Before TSMC N3 and FINFLEX™, chip designers often had to make difficult choices between speed, power consumption, and chip density.
TSMC N3 FINFLEX™ is a compelling new methodology, combining both process and design innovations, enabling full optimization of the N3 design library to meet both high performance and power efficient compute at the same time on the same die, while maximizing transistor density.
Powering the next generation of hybrid CPUs and chips, TSMC FINFLEX™ offers unprecedented flexibility with 3-2 fin blocks ideal for ultra high-performance CPU cores, a 2-2 fin configuration for efficient performance applications, and a 2-1 fin option for the ultra-power efficient, ultra-dense GPU cores and AI engines.
Learn more from TSMC blog:
TSMC FINFLEX™: Ultimate Performance, Power Efficiency, Density and Flexibility.